Code Change Summary: A new section was added requiring bonding for rigid metal conduit and intermediate metal conduit containing communications entrance wire or cable.

In the 2014 NEC^®, if rigid metal conduit (RMC) or intermediate metal conduit (IMC) is used to enclose communications entrance wire or cable, it must now be bonded to a grounding electrode in accordance with 800.100(B).

Section 800.100(B) permits the three following bonding methods:

1. Connection to the intersystem bonding terminal if present.
2. If the building has no intersystem bonding terminal the nearest one of the following must be used:
   • The building or structure grounding electrode system.
   • The grounded interior metal water piping system, within 5 ft. from its point of entrance to the building.
   • The power service accessible means external to enclosures as covered in 250.94.
   • The nonflexible metallic power service raceway.
   • The service equipment enclosure.
   • The grounding electrode conductor or the grounding electrode conductor metal enclosure of the power service, or
   • The grounding electrode conductor or the grounding electrode of a building or structure disconnecting means that is grounded to an electrode as covered in 250.32.
3. In buildings or structures without an intersystem bonding termination or grounding means:
   • To any one of the individual grounding electrodes described in 250.52(A)(1), (A)(2), (A)(3), or (A)(4).
   • To any one of the individual grounding electrodes described in 250.52(A)(7) and (A)(8) or to a ground rod or pipe.

Below is a preview of the NEC^®.  See the actual NEC^® text at NFPA.ORG for the complete code section. Once there, click on the “free access” tab and select the applicable year of NFPA 70 (National Electrical code).