Code Change Summary: The code requirements for the bonding of the pool water in 680.26(C) were reworded for easier application.
There are many items mentioned in 680.26 required to be bonded together and placed at the same potential. This includes conductive pool shells, perimeter surfaces, fixed metal parts, underwater lighting, electrical equipment, metallic components, metal fittings and even the pool water itself. The bonding method is not required to be run clear back to a remote panelboard but rather just to be installed to join all the items mentioned above together.
Placing everything in the vicinity of the pool at the same potential ensures that those swimming in the pool are protected and not susceptible to differences in electrical potential and stray voltages.
Bonding of the actual pool water has been required since the 2008 NEC®. New changes in the 2014 NEC® to section 680.26(C) require the pool water bonding method to be corrosion resistant and in contact with the pool water at all times. This makes it clear that the bonding method cannot simply be an isolated section of copper piping that only carries pool water when certain pool water features are enabled.
The new changes also make it clear that the pool water bonding method cannot be something that can be removed or dislodged during usual pool activities. This eliminates items such as removable stainless steel handrails or ladders, used as a pool water bonding method, from being removed and eliminating the pool water bond.
Below is a preview of the NEC®. See the actual NEC® text at NFPA.ORG for the complete code section. Once there, click on the “free access” tab and select the applicable year of NFPA 70 (National Electrical code).
2011 Code Language:
680.26(C) Pool Water. An intentional bond of a minimum conductive surface area of 5800 mm2 (9 in.2) shall be installed in contact with the pool water. This bond shall be permitted to consist of parts that are required to be bonded in 680.26(B).
2014 Code Language:
680.26(C) Pool Water. Where none of the bonded parts is in direct connection with the pool water, the pool water shall be in direct contact with an approved corrosion-resistant conductive surface that exposes not less than 5800 mm2 (9 in.2) of surface area to the pool water at all times. The conductive surface shall be located where it is not exposed to physical damage or dislodgement during usual pool activities, and it shall be bonded in accordance with 680.26(B).
Which of the following is true when bonding pool water?
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